2006 IEEE MTT - S
INTERNATIONAL MICROWAVE SYMPOSIUM
June 11-16, 2006
Call
for Papers
The IEEE MTT-S
International Microwave Symposium 2006 (IMS2006) will be held in
Microwave Week 2006: The IMS2006 technical
sessions will run Tuesday through Thursday of Microwave Week. Workshops will be
held on Sunday, Monday, and Friday. In addition to IMS2006, a microwave
exhibition, an historical exhibit, the RFIC Symposium (www.rfic2006.org), and the ARFTG Conference
(www.arftg.org) will also be held in
Electronic Paper Submission: Technical papers for this symposium must be submitted via the IMS2006 web site, www.ims2006.org. Complete information on how to submit a paper and register for the conference, as well as other important information, can be found at the IMS2006 web site.
Proposals Invited: Workshop (Tutorial through Expert level), Special Session (Focused and Honorary), and Panel/Rump Session proposals are invited. To suggest topics, or to volunteer to help organize or participate in a Workshop, Special Session or Panel Session, contact the appropriate committee member listed on this page.
Electronic Submission Deadlines
Proposals for short courses, workshops, panels, and special sessions: September 9, 2005
Technical Paper Summaries: December 2, 2005
Final Manuscripts: March 10, 2006
All submissions must be made through the IMS2006 portal: www.ims2006.org
ALL SUBMISSIONS MUST BE IN PDF FORM Hard copies not accepted
The authors are responsible for formatting. Font embedding must be IEEE Xplore compatible.
To submit a paper, start by downloading a template from www.ims2006.org. Authors must adhere to the format provided in this template. The paper must be in pdf format and the file size must be less than 1 MB.
Submit the paper at www.ims2006.org by December 2, 2005. Late submissions will not be accepted. The system will only accept four pages, including text and figures.
Authors of accepted papers will be required to submit a final paper for publication in the Symposium CD-ROM. Notice of paper acceptance and the necessary information to electronically submit this final version of the paper will be sent to the authors in January 2006.
Paper Selection Criteria: All submissions must be in English. IMS2006 Technical Program subcommittees will review papers. The selection criteria will include the following factors:
• Originality: How is the contribution unique, significant, and state-of-the-art?
• Quantitative content: Does the paper give an explicit description of the work with complete supporting data?
• Clarity: Is the contribution clear? Are the writing and accompanying figures clear and understandable? Are references to previous work by the authors and others included?
• Interest to MTT-S membership: Why should this work be reported at this conference?
Clearances: It is the author’s responsibility to obtain all required company and government clearances prior to submitting a paper. A statement that such clearances have been obtained, signed by the submitting author, and a completed IEEE copyright form must accompany the final manuscript of each accepted paper. Details regarding clearances will be available through the paper submission web site (www.ims2006.org)
Technical Areas: Author-selected technical areas (see next page) will be used to determine the appropriate review committees. Choose a primary and alternative area when you complete the author registration form. The paper abstract should contain information that clearly reflects the choice of area. Paper submitted to an inappropriate committee may lead to its rejection.
Presentation Format: The International Microwave Symposium offers three types of presentations:
˜ Full-Length Papers report significant contributions, advancements, or applications of microwave technology in a formal presentation format with limited audience interaction.
˜ Short Papers typically report specific refinements or improvements in the state-of-the-art in a formal presentation format with limited audience interaction.
˜ Interactive Forum Papers provide an opportunity for authors to present theoretical or experimental results in greater detail, and in poster format, and/or to display hardware, perform demonstrations, and/or conduct discussions in an informal manner with interested colleagues.
The author’s preference will be honored where possible, but the paper will be placed in the most appropriate area and a presentation format consistent with the constraints of the Technical Program. All presentations at IMS2006 will be given using electronic data projection. No 35-mm slide projectors or overhead transparency projectors will be available.
Student Paper Contest and IMS2006 Early Career Travel Grant: A Student Paper Contest will be held as part of the Symposium. Student papers will be reviewed in the same manner as all other conference papers. Papers accepted for the competition will be judged on content and presentation. First, second, and third prizes will be awarded. To be considered for an award, the student must have been a full time student (minimum 9-hours/term graduate, 12-hours/term undergraduate) during the time the work was performed, be the lead author and must present the paper at the Symposium. The student is required to provide the e-mail address of the advisor as a part of the paper submission process. A memorandum will be automatically sent to the advisor to certify that the work is primarily that of the student. In addition to the Student Paper Contest, an IMS2006 Early Career Travel Grant will be available. The details can be found at the IMS2006 web site.
Notification: Authors will be notified of the decision in January 2006 Authors of accepted papers will be notified by e-mail. The acceptance letter will refer the author to the web site for forms and detailed instructions for preparing manuscripts for publication. Final manuscripts must be received by Friday, March 10, 2006 to be published in the CD-ROM and to qualify for presentation at the Symposium.
TECHNICAL AREAS
1. Field Analysis and Guided
Waves
Novel guiding structures, new physical phenomena in transmission lines and other wave guiding structures, and new analytical methods for solving guided-wave problems.
2. Frequency Domain
Techniques
Frequency domain methods for numerical solution of electromagnetic problems, including field interactions with devices, circuits, and with other physical processes.
3. Time Domain Techniques
Time domain methods for numerical modeling of high-frequency electronics, including modeling based on physical behaviors (electromagnetic, semiconductor, thermal, mechanical).
4. CAD Algorithms and
Techniques
Circuit analysis methods, optimization methods, statistical analysis.
5. Linear Device Modeling
Linear models of active and passive devices, models.
6. Non-linear Device
Modeling
Large-signal device models, characterization, parameter extraction, validation.
7. Non-linear Circuit
Analysis and System Simulation
Harmonic balance, simulation techniques, distortion and spurious analysis, system simulations, and behavioral modeling.
8. Transmission Line
Elements
Planar, non-planar, and micromachined transmission lines and waveguides, including periodic and metamaterial-type structures, discontinuities, junctions, and transitions.
9. Passive Circuit Elements
Couplers, dividers/combiners, hybrids, resonators, lumped element approaches to circuit design.
10. Planar Passive
Filters and Multiplexers
Innovative synthesis and analysis of planar filters and multiplexers. Includes planar superconducting structures, DGS, EBG and other structures.
11. Non-Planar Passive
Filters and Multiplexers
Waveguide, Dielectric Resonator and non-planar Superconducting Structures
12. Active and Metamaterial- based filters
Integrated filters (on Silicon, LTCC, LCP, MCM-D, GaAs, …), active, tunable and reconfigurable filters.
13. Ferroelectric, Ferrite,
and Acoustic Wave Components
Ferroelectric devices, bulk and thin film ferrite components, Surface and Bulk Acoustic Wave Devices including FBAR devices.
14. MEMS Components and
Technologies
RF microelectromechanical and micromachined components and subsystems: switches, resonators, tunable passive filters, phase shifters, reconfigurable filters and antennas. Modeling, packaging, reliability, novel materials and assembly processes.
15. Emerging Applications
for RF/Microwaves
Components and sub-systems for emerging applications including WLAN, WiMax, Wi-Fi, UMTS, UWB, 3G/4G, RFID.
New applications of RF/Microwave technologies.
16. Semiconductor Devices
and Monolithic IC Technologies
Multifunction and monolithic integrated components: RF, microwave and millimeter‐wave MMICs on GaAs, SiGe Ics and other technologies. MMIC manufacturing, reliability, failure analysis, yield and cost.
17. Signal Generation
CW and pulsed oscillators. VCOs, DROs, YTOs, PLOs, and frequency synthesizers. Applications of new devices and resonators. Noise in oscillators. DDS techniques.
18. Frequency Conversion and
Control
Electronic switches, phase shifters, limiters, mixers, frequency multipliers and frequency dividers.
19. HF/VHF/UHF Technologies
and Applications
Technology for HF, VHF and UHF including passive and active components, lumped and distributed elements, transmitters and receivers.
20. Power-Amplifier Devices
and Integrated Circuits
Design and performance of discrete and IC power amplifiers for RF, microwave and millimeter-wave signals, wide bandgap devices.
21. High-Power Amplifiers
High power amplifier design and characterization, linearization techniques, power combining techniques. Vacuum electronics.
22. Low Noise Components and
Receivers
Low-noise amplifiers, detectors, devices, receivers, radiometers, models and characterization methods for low-noise circuits and components.
23. Millimeter Wave and Terahertz Components and Technologies
Millimeter wave components, technologies, and applications above 30 GHz, submillimeter wave/terahertz devices, instruments and applications including THz imaging.
24. Microwave Photonics
Microwave/optical interactions and device technology. Wireless over fiber, free-space optical technology, broadband cable applications of photonics. Optical transmission effects.
25. Digital Circuits at GHz Speeds
High-speed electrical components, modules, transceivers, interconnects and sub-systems for high-speed digital formats including OC-192, OC-768, 10-Gb Ethernet, Infiniband.
26. Packaging,
Interconnects, MCMs, and Hybrid Manufacturing
Dielectrics and substrates, component and subsystem packaging, assembly methods, hybrid integration, interconnects and multi-chip modules (MCMs), Hybrid manufacturing, yield and cost.
27. Instrumentation and
Measurement Techniques
Network, time-domain, and spectral measurements, field mapping, error correction and estimation, materials measurements.
28. Biological Effects and
Medical Applications
Biomedical applications of microwaves, applications in biology, microwave fields and interactions in tissues.
29. Smart Antennas, Spatial Power Combining and Phased Arrays
Smart antennas for wireless applications, spatial power combining, phased arrays, retrodirective systems, T/R modules, multiple-beam scanning, active integrated antennas.
30. Radars and Broadband
Communication Systems
Broadband and MMW communication systems for terrestrial, vehicular, satellite and indoor applications. Radar systems and subsystems. UWB systems and subsystems.
31. Wireless and Cellular
Communication Systems
Cellular systems, direct conversion receivers, wireless LANs and WANs, 802.11x, Software defined radio, Bluetooth, ZigBee, CDMA, GSM, GPRS and EDGE.
32. Sensors and Sensor
Systems
RFID, IVHS, wireless microsensors, nondestructive testing, imaging, and remote sensing.
Electronic
Submission Deadlines
Proposals for short courses, workshops, panels, and special sessions: September 9, 2005
Technical Paper Summaries: December 2, 2005
Final Manuscripts: March 10, 2006
All submissions must be made through the IMS2006 portal: www.ims2006.org
ALL
SUBMISSIONS MUST BE IN PDF FORM Hard copies not accepted
The authors are responsible for formatting. Font embedding must be IEEE Xplore compatible.