2006 IEEE MTT - S
INTERNATIONAL MICROWAVE SYMPOSIUM
June 11-16, 2006
San Francisco, California
Call
for Papers
The IEEE MTT-S International
Microwave Symposium 2006 (IMS2006) will be held in San Francisco, California,
Sunday, June 11 through Friday, June 16, 2006 as the centerpiece of Microwave
Week 2006. Technical papers describing original work in research, development,
and application of RF and microwave theory and techniques are solicited.
Microwave Week 2006: The IMS2006 technical sessions will run
Tuesday through Thursday of Microwave Week. Workshops will be held on Sunday,
Monday, and Friday. In addition to IMS2006, a microwave exhibition, an
historical exhibit, the RFIC Symposium (www.rfic2006.org),
and the ARFTG Conference (www.arftg.org) will also be held in San Francisco during
Microwave Week 2006.
Electronic Paper Submission: Technical papers for this symposium must
be submitted via the IMS2006 web site, www.ims2006.org.
Complete information on how to submit a paper and register for the conference,
as well as other important information, can be found at the IMS2006 web site.
Proposals Invited: Workshop (Tutorial through Expert level),
Special Session (Focused and Honorary), and Panel/Rump Session proposals are
invited. To suggest topics, or to volunteer to help organize or participate in
a Workshop, Special Session or Panel Session, contact the appropriate committee
member listed on this page.
Northern California is a wonderful
place to visit and the weather in June is quite pleasant. See the Golden Gate
Bridge, Fisherman’s Wharf, China Town, Golden Gate Park, Coit Tower, Muir
Woods, the Wine Country, the Pacific coast, Alcatraz and Treasure Islands and
many other sites. Many of these sites will be destinations in our guest
program.
Electronic Submission Deadlines
Proposals for short courses,
workshops, panels, and special sessions: September 30, 2005
Technical Paper Summaries:
December 2, 2005
Final Manuscripts: March 10, 2006
All submissions must be made
through the IMS2006 portal: www.ims2006.org
ALL SUBMISSIONS MUST
BE IN PDF FORM Hard copies not accepted
The authors are responsible for
formatting. Font embedding must be IEEE Xplore compatible.
To submit a paper, start by downloading a template from www.ims2006.org. Authors must adhere to the
format provided in this template. The paper must be in pdf format and the file
size must be less than 1 MB.
Submit the paper at www.ims2006.org by December 2, 2005. Late
submissions will not be accepted. The system will only accept four pages, including
text and figures.
Authors of accepted papers will be
required to submit a final paper for publication in the Symposium CD-ROM.
Notice of paper acceptance and the necessary information to electronically
submit this final version of the paper will be sent to the authors in January
2006.
Paper Selection Criteria: All submissions must be in English.
IMS2006 Technical Program subcommittees will review papers. The selection
criteria will include the following factors:
• Originality: How is the
contribution unique, significant, and state-of-the-art?
• Quantitative content: Does the
paper give an explicit description of the work with complete supporting data?
• Clarity: Is the contribution
clear? Are the writing and accompanying figures clear and understandable? Are
references to previous work by the authors and others included?
• Interest to MTT-S membership:
Why should this work be reported at this conference?
Clearances: It is the author’s responsibility to obtain
all required company and government clearances prior to submitting a paper. A
statement that such clearances have been obtained, signed by the submitting
author, and a completed IEEE copyright form must accompany the final manuscript
of each accepted paper. Details regarding clearances will be available through
the paper submission web site (www.ims2006.org)
Technical Areas: Author-selected technical areas (see next
page) will be used to determine the appropriate review committees. Choose a
primary and alternative area when you complete the author registration form.
The paper abstract should contain information that clearly reflects the choice
of area. Paper submitted to an inappropriate committee may lead to its
rejection.
Presentation Format: The International Microwave Symposium
offers three types of presentations:
˜ Full-Length Papers report significant contributions,
advancements, or applications of microwave technology in a formal presentation
format with limited audience interaction.
˜ Short Papers typically report specific refinements or
improvements in the state-of-the-art in a formal presentation format with
limited audience interaction.
˜ Interactive Forum Papers provide an opportunity for authors to
present theoretical or experimental results in greater detail, and in poster
format, and/or to display hardware, perform demonstrations, and/or conduct
discussions in an informal manner with interested colleagues.
The author’s preference will be
honored where possible, but the paper will be placed in the most appropriate
area and a presentation format consistent with the constraints of the Technical
Program. All presentations at IMS2006 will be given using electronic data
projection. No 35-mm slide projectors or overhead transparency projectors will
be available.
Student Paper Contest and
IMS2006 Early Career Travel Grant: A Student Paper Contest will be held as part of the Symposium. Student
papers will be reviewed in the same manner as all other conference papers.
Papers accepted for the competition will be judged on content and presentation.
First, second, and third prizes will be awarded. To be considered for an award,
the student must have been a full time student (minimum 9-hours/term graduate,
12-hours/term undergraduate) during the time the work was performed, be the
lead author and must present the paper at the Symposium. The student is
required to provide the e-mail address of the advisor as a part of the paper
submission process. A memorandum will be automatically sent to the advisor to
certify that the work is primarily that of the student. In addition to the
Student Paper Contest, an IMS2006 Early Career Travel Grant will be available.
The details can be found at the IMS2006 web site.
Notification: Authors will be notified of the decision
in January 2006 Authors of accepted papers will be notified by e-mail. The
acceptance letter will refer the author to the web site for forms and detailed
instructions for preparing manuscripts for publication. Final manuscripts must
be received by Friday, March 10, 2006 to be published in the CD-ROM and to
qualify for presentation at the Symposium.
TECHNICAL AREAS
1.
Field Analysis and Guided Waves
Novel
guiding structures, new physical phenomena in transmission lines and other wave
guiding structures, and new analytical methods for solving guided-wave
problems.
2.
Frequency Domain Techniques
Frequency
domain methods for numerical solution of electromagnetic problems, including
field interactions with devices, circuits, and with other physical processes.
3.
Time Domain Techniques
Time
domain methods for numerical modeling of high-frequency electronics, including
modeling based on physical behaviors (electromagnetic, semiconductor, thermal,
mechanical).
4.
CAD Algorithms and Techniques
Circuit
analysis methods, optimization methods, statistical analysis.
5.
Linear Device Modeling
Linear
models of active and passive devices, models.
6.
Non-linear Device Modeling
Large-signal
device models, characterization, parameter extraction, validation.
7.
Non-linear Circuit Analysis and System Simulation
Harmonic
balance, simulation techniques, distortion and spurious analysis, system
simulations, and behavioral modeling.
8.
Transmission Line Elements
Planar,
non-planar, and micromachined transmission lines and waveguides, including
periodic and metamaterial-type structures, discontinuities, junctions, and
transitions.
9.
Passive Circuit Elements
Couplers,
dividers/combiners, hybrids, resonators, lumped element approaches to circuit
design.
10.
Planar Passive Filters and Multiplexers
Innovative
synthesis and analysis of planar filters and multiplexers. Includes planar
superconducting structures, DGS, EBG and other structures.
11.
Non-Planar Passive Filters and Multiplexers
Waveguide,
Dielectric Resonator and non-planar Superconducting Structures
12.
Active and Metamaterial- based filters
Integrated
filters (on Silicon, LTCC, LCP, MCM-D, GaAs, …), active, tunable and
reconfigurable filters.
13.
Ferroelectric, Ferrite, and Acoustic Wave Components
Ferroelectric
devices, bulk and thin film ferrite components, Surface and Bulk Acoustic Wave
Devices including FBAR devices.
14.
MEMS Components and Technologies
RF
microelectromechanical and micromachined components and subsystems: switches,
resonators, tunable passive filters, phase shifters, reconfigurable filters and
antennas. Modeling, packaging, reliability, novel materials and assembly
processes.
15.
Emerging Applications for RF/Microwaves
Components
and sub-systems for emerging applications including WLAN, WiMax, Wi-Fi, UMTS,
UWB, 3G/4G, RFID.
New
applications of RF/Microwave technologies.
16.
Semiconductor Devices and Monolithic IC Technologies
Multifunction and monolithic integrated components: RF, microwave and millimeter‐wave MMICs on GaAs, SiGe Ics and other technologies. MMIC manufacturing, reliability, failure analysis, yield and cost.
17.
Signal Generation
CW and pulsed oscillators. VCOs, DROs, YTOs, PLOs, and frequency synthesizers. Applications of new devices and resonators. Noise in oscillators. DDS techniques.
18.
Frequency Conversion and Control
Electronic
switches, phase shifters, limiters, mixers, frequency multipliers and frequency
dividers.
19.
HF/VHF/UHF Technologies and Applications
Technology
for HF, VHF and UHF including passive and active components, lumped and
distributed elements, transmitters and receivers.
20.
Power-Amplifier Devices and Integrated Circuits
Design and
performance of discrete and IC power amplifiers for RF, microwave and
millimeter-wave signals, wide bandgap devices.
21.
High-Power Amplifiers
High
power amplifier design and characterization, linearization techniques, power
combining techniques. Vacuum electronics.
22.
Low Noise Components and Receivers
Low-noise
amplifiers, detectors, devices, receivers, radiometers, models and
characterization methods for low-noise circuits and components.
23.
Millimeter Wave and Terahertz Components and Technologies
Millimeter
wave components, technologies, and applications above 30 GHz, submillimeter
wave/terahertz devices, instruments and applications including THz imaging.
24.
Microwave Photonics
Microwave/optical
interactions and device technology. Wireless over fiber, free-space optical
technology, broadband cable applications of photonics. Optical transmission
effects.
25. Digital Circuits at GHz Speeds
High-speed
mixed-signal components, modules, and sub-systems; ADC, DAC and DDS;
interconnections and backplanes; signal integrity & equalization;
electrical/optical interfaces & transmission.
26.
Packaging, Interconnects, MCMs, and Hybrid Manufacturing
Dielectrics
and substrates, component and subsystem packaging, assembly methods, hybrid
integration, interconnects and multi-chip modules (MCMs), Hybrid manufacturing,
yield and cost.
27.
Instrumentation and Measurement Techniques
Network,
time-domain, and spectral measurements, field mapping, error correction and
estimation, materials measurements.
28.
Biological Effects and Medical Applications
Biomedical
applications of microwaves, applications in biology, microwave fields and
interactions in tissues.
29.
Smart Antennas, Spatial Power Combining and Phased Arrays
Smart
antennas for wireless applications, spatial power combining, phased arrays,
retrodirective systems, T/R modules, multiple-beam scanning, active integrated
antennas.
30.
Radars and Broadband Communication Systems
Broadband
and MMW communication systems for terrestrial, vehicular, satellite and indoor
applications. Radar systems and subsystems. UWB systems and subsystems.
31.
Wireless and Cellular Communication Systems
Cellular
systems, direct conversion receivers, wireless LANs and WANs, 802.11x, Software
defined radio, Bluetooth, ZigBee, CDMA, GSM, GPRS and EDGE.
32.
Sensors and Sensor Systems
RFID,
IVHS, wireless microsensors, nondestructive testing, imaging, and remote
sensing.
Electronic Submission
Deadlines
Proposals for short courses,
workshops, panels, and special sessions: September 30, 2005
Technical Paper Summaries:
December 2, 2005
Final Manuscripts: March 10, 2006
All submissions must be made
through the IMS2006 portal: www.ims2006.org
ALL SUBMISSIONS MUST BE
IN PDF FORM Hard copies not accepted
The authors are responsible for formatting. Font embedding must be
IEEE-Xplore compatible.